chiptopackage

Chiptopackage is a term used in semiconductor packaging to describe configurations in which the active silicon die is mounted on the top surface of a packaging substrate or interposer, rather than being enclosed below the top surface or embedded inside the package. The exact meaning of the term varies by source, and it is not a standardized industry label. In some contexts, chiptopackage refers to top-mounted dies in package-in-package (PiP) or multi-die assemblies, while in others it describes top-side die attachment within a single package that aims to optimize heat spreading.

The primary motivation for chiptopackage approaches is to improve thermal performance and enable compact form factors. By placing the die on the top surface, engineers can provide a direct heat path to a heatsink or spreader and reduce interconnect lengths, which can benefit high-power, RF, or sensor modules. Implementations may employ flip-chip or wire-bond connections to the top of the package, along with thermal management features such as heat spreaders or solder-directed interfaces. These configurations can also enable tighter packing and shorter electrical traces, contributing to performance gains in certain applications.

Design considerations for chiptopackage include thermal management, mechanical reliability, passivation and bonding integrity at the top surface, and parasitic control for timing and signal integrity. Manufacturing complexity and cost are typically higher than for conventional bottom-mounted die packages, and repairability can be more challenging. Chiptopackage remains one of several approaches in the broader field of advanced packaging, including flip-chip, FO-WLP, and 3D integration.

See also: packaging technologies, flip-chip, PoP, 3D IC, FoWLP.