SIP

System in Package (SiP) is a packaging approach in which multiple integrated circuits and other components are integrated into a single module or package to realize a complete electronic system. In a SiP, dies such as processors, memories, RF transceivers, sensors, and power management ICs are assembled in a compact form factor and interconnected within the same package or on a common substrate.

The components in a SiP can be arranged side by side or stacked, and they are connected by methods such as wire bonding, flip-chip, or embedded interconnects. The package may use organic laminates, ceramic, or other substrates, and can include passive components and multiple die sharing a common interconnect network. This heterogeneous integration enables different technology nodes and functions to coexist in a single, compact unit.

SiP offers several benefits, including reduced board area and height, shorter interconnect paths, and faster time to market. It enables combining multiple functions with different process technologies, supporting high levels of integration without designing a single application-specific integrated circuit. It is well suited for mobile devices, wearables, Internet of Things products, automotive electronics, and aerospace applications where space, weight, or cost constraints are critical.

Challenges include higher manufacturing complexity, thermal management, reliability testing, and potentially higher per-unit costs at lower volumes. SiP is often discussed in relation to other packaging and integration approaches such as chiplets, 2.5D/3D integration, and traditional system-on-chip (SoC) designs, serving as a flexible option for heterogeneous system integration.