Microdicing

Microdicing is a precision material-processing technique in which a substrate is segmented into many small pieces or structures, typically by making a grid of narrow cuts and separating the pieces. It is used to produce micro-dies, microchips, or micro-structures from wafers or bulk materials. The process can employ mechanical dicing with ultra-narrow blades or laser-based micromachining. In mechanical dicing, a dicing saw or micro-blade is advanced along predefined lines with controlled depth, feed rate, and kerf width, often under coolant to reduce heat and debris. In laser micromachining, focused ultrafast lasers create micro-kerfs or induce controlled fracture, allowing dicing of fragile materials or complex geometries.

Materials commonly processed include silicon, glass, quartz, ceramics, sapphire, polymers, and composite materials. Applications span micro-electromechanical systems (MEMS), microfluidic chips, micro-optical components, sensors, and tightly packed multi-die arrays for advanced packaging. The technique enables high-density packaging, reduced assembly steps, and the creation of micro-scale arrays for testing or integration.

Challenges include kerf losses, edge chipping and cracks, heat-affected zones in laser methods, debris management, and the need for precise alignment and handling of fragile substrates. Quality control typically involves metrology to verify die size, location accuracy, and surface integrity.

See also: microfabrication, MEMS, laser micromachining.