CMOSNEMS

CMOSNEMS refers to systems that integrate nanoelectromechanical components with complementary metal-oxide-semiconductor (CMOS) technology to create compact, on-chip devices in which mechanical motion at nanoscale dimensions is coupled to electronic circuitry. The approach combines the high-density, low-power advantages of CMOS with the high sensitivity and functionality of NEMS, enabling compact sensors, actuators, and signal-processing elements.

There are two primary integration strategies. Monolithic CMOS-NEMS aims to fabricate the NEMS elements within or directly on top of a CMOS wafer, often using post-processing steps to release suspended nanostructures without disturbing the underlying circuitry. Hybrid or heterogeneous CMOS-NEMS involves fabricating the NEMS devices on a separate substrate and then bonding or stacking them with a CMOS wafer or package, allowing independent optimization of each subsystem.

Common transduction methods include capacitive, piezoresistive, and piezoelectric schemes, where mechanical motion shifts a capacitance, changes a resistance, or generates a charge signal. On-chip CMOS readout circuits convert these signals into usable electrical outputs, enabling closed-loop control, amplification, filtering, and digital processing. Typical performance targets range from megahertz to gigahertz operation for nanoscale resonators, with design attention to quality factors, noise, and parasitics. The result is potential for compact RF components, timing references, and highly sensitive mass or chemical sensors, as well as inertial sensing when combined with appropriate signal processing.

Applications span RF MEMS filters and switches, precision oscillators and timing references, lab-on-a-chip sensing platforms, and integrated inertial or biosensing systems. Challenges include process compatibility between CMOS and NEMS materials, device yield and variability, reliability under packaging and environmental stress, stiction and wear for moving parts, and thermal management. Ongoing work seeks to improve manufacturability, robustness, and cost-effectiveness to enable broader commercialization.