3DICer
3DICer is a professional who designs and analyzes three-dimensional integrated circuits, where multiple dies or heterogeneous components are stacked or packaged in a single system. The role covers architecture, partitioning, and inter-die communication, using techniques such as through-silicon vias, microbumps, and silicon interposers to achieve compact, high-performance devices.
A 3DICer coordinates system-level design across dies, performs floorplanning and timing closure for cross-layer interconnects, and
Key technologies include monolithic 3D integration, TSV-based stacking, interposer-assisted 2.5D packaging, and heterogeneous integration. Design considerations
Applications include mobile system-on-chips, AI accelerators, high-performance and data-center processors, and memory stacking such as high-bandwidth