temperatuuritsüklitest

Temperatuuritsüklitest refers to a systematic testing procedure in which a material, component, or system is repeatedly exposed to alternating high and low temperatures. The primary purpose of these tests is to evaluate how well an item can withstand thermal stress over time, mimicking real‑world environmental fluctuations that may cause mechanical failure, corrosion, or performance degradation.

During a typical temperature cycle, the test environment is first brought to a defined low temperature, often below ambient, and held for a specified dwell time. The specimen is then rapidly heated to a high temperature above ambient, again held for a period. The rate of temperature change, the magnitude of the temperature swing, and the total number of cycles are tailored to the intended application and industry standards. For example, consumer electronics subjected to 200 cycles between –40 °C and +85 °C are considered to meet high reliability criteria, while automotive components may endure hundreds or thousands of cycles with tighter dwell times.

Temperature cycle testing is employed across a range of sectors: in packaging, it ensures seal integrity under shipping conditions; in the semiconductor industry, it verifies the longevity of integrated circuits and bonding wire loops; in aerospace, it safeguards composite materials and fasteners against thermal fatigue.

Because the test replicates long‑term aging in a compressed time frame, results are often analyzed via accelerated failure time models, revealing both the dominant failure modes and the expected service life of the product.