chipletpohjaiset
Chiplet-based designs represent a modern approach to semiconductor manufacturing, where complex integrated circuits (ICs) are constructed by combining multiple smaller, specialized components called "chiplets." Unlike traditional monolithic chips, which integrate all functions into a single die, chiplets are discrete modules that can be designed, manufactured, and optimized independently before being interconnected on a substrate or through advanced packaging techniques.
The primary advantage of chiplet-based designs lies in their modularity and scalability. Each chiplet can be
Key technologies enabling chiplet-based designs include advanced packaging methods like 2.5D and 3D integration, which stack
While chiplet-based designs offer significant benefits, challenges remain, including increased complexity in thermal management, signal integrity,