Chiplet

A chiplet is a modular design approach in which a system on a chip is assembled from multiple smaller dies, or chiplets, that are integrated within a single package. Each chiplet typically implements a distinct function, such as processor cores, memory, or accelerators, and communicates with others through high-speed interconnects.

Chiplet designs use advanced packaging techniques, including 2.5D interposers, 3D stacking, and chip-to-package interconnections. Popular interconnect approaches include EMIB (embedded multi-die interconnect bridge) and Foveros in packaging, while standardization efforts focus on enabling interoperability across vendors.

The development of chiplets has been driven by yield and cost advantages of producing many small dies rather than a single large die. The introduction of standards like the Universal Chiplet Interconnect Express (UCIe) aims to provide a common interface for chiplet communication and integration.

Notable industry activity includes AMD’s use of CPU chiplets in its Ryzen line, combining multiple compute dies with an I/O die in a single package; Intel’s 3D and multi-die packaging programs; and ongoing adoption across data centers for AI accelerators and heterogeneous processors.

Benefits of chiplets include improved manufacturing yield, supply chain flexibility, design reuse, and the ability to mix heterogeneous architectures (for example combining CPUs, GPUs, and memory together). However, challenges include memory coherency, latency penalties, thermal management, IP protection, and standardization across vendors.

As packaging technology and interconnect standards mature, chiplets are expected to become a common approach for high-performance computing, edge devices, and AI workloads, enabling scalable performance while reducing the cost and risk of producing large monolithic dies.