TSSOP32

TSSOP32, or 32-pin Thin Shrink Small Outline Package, is a surface-mount integrated circuit package designed to provide a compact, low-profile option for higher pin counts. The package uses gull-wing leads arranged on two opposite sides of a small rectangular body, enabling dense PCB layouts while remaining compatible with standard reflow soldering processes.

Physical characteristics commonly include 32 leads with a lead pitch around 0.65 mm. The body width for TSSOP variants is typically around 4.4 mm, with overall height in the low millimeter range. Unlike some power packages, TSSOP32 generally does not include an exposed bottom thermal pad, although exact dimensions and features can vary by manufacturer and part family. The package is molded in epoxy and designed for automated assembly and testing.

Electrical and thermal considerations depend on the specific device housed in the package. TSSOP32 provides moderate pin density suitable for mixed-signal, analog, and small microcontroller or memory devices. Thermal performance is largely governed by the PCB layout and ambient conditions, rather than by a heatsink inside the package.

Applications for TSSOP32 include microcontrollers, operational amplifiers, analog-to-digital and digital-to-analog converters, voltage regulators, and other integrated circuits used in consumer electronics, automotive, telecommunications, and industrial equipment where space conservation is important.

In comparison with larger or thicker packages, TSSOP32 offers a smaller footprint and lower profile while maintaining a similar pin count, making it a common choice for compact, cost-conscious designs. Variants exist within the TSSOP family that adjust body width and lead configurations to suit specific design requirements.