TO252

TO-252, also known as DPAK, is a surface-mount power semiconductor package defined by JEDEC as TO-252. It is used for power devices such as MOSFETs, IGBTs, diodes, and voltage regulators. The package consists of a molded plastic body with three leads on one edge and an attached metal tab that serves as the fourth terminal. The metal tab is typically connected to the drain or collector of the device and also serves as a primary heat-dissipation surface. An exposed bottom pad provides an additional heat path to the PCB.

It is designed for surface-mount assembly and is compatible with reflow soldering. The package enables relatively low-profile mounting and relatively high current handling for its size, with device ratings ranging from tens to hundreds of volts and currents from several amperes up to tens of amperes depending on the die and cooling. Effective thermal performance depends on the PCB copper area under the package and, if used, thermal vias.

Footprint and usage: common in switch-mode power supplies, motor drivers, automotive electronics, and other compact power applications. It competes with larger packages like TO-263 (D2PAK) for medium power and with TO-220 variants for bulk mounting. Designers typically provide a large copper pad under the package and a generous drain pad to maximize heat dissipation.

Variants: multiple variants and vendor-specific naming exist; TO-252 is the general designation, while DPAK is a widely used alternative name.