TO263

TO-263, also known as D2PAK, is a surface-mount power semiconductor package defined by JEDEC. It is used for high-current, high-voltage devices such as MOSFETs, IGBTs, diodes, and voltage regulators. The package provides a compact, thermally efficient way to mount power devices on printed circuit boards.

The package features a large metal heat slug (tab) that serves as the drain connection and the primary thermal path, along with three leads that extend from one edge. The leads typically correspond to the gate, drain, and source terminals, while the drain is commonly connected to the tab. This arrangement allows higher power dissipation than smaller surface-mount packages while maintaining a relatively low profile.

Electrical and mechanical considerations include reflow soldering on a PCB, with a bottom or exposed pad connected to the heat slug to improve heat transfer. Footprint guidelines emphasize a substantial copper area, good thermal vias if used, and appropriate clearance to accommodate the package dimensions and solder fillet formation.

Applications for TO-263 devices span power supplies, DC-DC converters, motor drives, and automotive electronics, where reliable high-current performance and compact form factor are required. The TO-263 family provides a balance between power handling capability and assembly efficiency, and it is commonly used as an alternative to through-hole or larger surface-mount power packages in many discrete and power-management devices.