D2PAK

D2PAK, also known as TO-263, is a surface-mount power semiconductor package used for high-current devices such as MOSFETs, IGBTs, diodes, and high-power voltage regulators. It is a variant of the standard TO-252 family designed to provide improved heat dissipation while remaining compatible with surface-mmount assembly processes.

The package consists of a molded plastic body with three electrical leads extending from one edge and a large metal heat-spreading tab connected to the device’s power terminal. The three leads typically carry the gate, source, and drain (or a similar arrangement depending on the device), while the metal tab serves as the primary heat sink and is commonly connected to the drain or collector internally. This configuration enables substantial current handling with a relatively low profile for surface-mount applications.

D2PAK is larger than the DPAK (TO-252) package, offering higher current capability and better thermal performance due to its larger heat-dissipation surface. It is widely used in switching power supplies, motor drives, inverters, and other high-power circuits where efficient heat removal is essential.

Mounting requires a PCB footprint with a substantial copper area under the tab and appropriate solder pads for the three leads. Proper thermal design, including vias to thermal planes, is often employed to maximize heat transfer from the tab to the surrounding board.

See also: DPAK (TO-252), TO-263, JEDEC power package families.