smalloutline

Small-outline refers to a family of surface-mount integrated circuit (IC) packages, most commonly the small-outline integrated circuit (SOIC). SOICs are designed as a compact alternative to through-hole DIP packages, enabling automated assembly, higher device density, and reduced board space.

The package is a rectangular plastic body with gull-wing leads along two long sides. Pin counts typically range from about 8 to 28, with higher-pin variants available. Standard body widths are commonly described as narrow or wide, and lead pitch is usually 1.27 mm (0.05 inches) or finer in newer variants. SOICs are intended for reflow soldering and are mounted directly onto the surface of a printed circuit board.

Variants within the small-outline family include standard SOICs, narrow SOICs (for higher density), and thinner forms such as MSOP (micro-SOIC) and TSSOP (thin shrink small-outline). These variants provide different pitch, height, and body dimensions to accommodate various pin counts and thermal requirements. The term SOIC is often used generically, while “SOP” (small-outline package) is a broader label used in some contexts.

Applications and usage are widespread across consumer electronics, computing, automotive, and industrial equipment. SOICs are favored for moderate to high pin counts where surface-mount assembly is desired, though they present greater soldering challenges than smaller chip-scale packages and require appropriate thermal and mechanical considerations.

Standards and terminology for small-outline packages are established by industry bodies and are widely used in electronics manufacturing to describe form factor, pin configuration, and lead style.