SOIC

SOIC stands for Small Outline Integrated Circuit. It is a family of surface-mount IC packages characterized by a rectangular body with two rows of gull-wing leads along the longer sides. SOICs are the surface-mount counterparts to the traditional DIP, offering high pin counts in a compact footprint and enabling automated assembly.

Two common body widths are used: narrow (about 3.9 mm) and wide (about 4.9 mm). Lead pitch is typically 1.27 mm between adjacent pins on each side. Lead counts commonly range from 8 to 28 pins, with popular variants including SOIC-8, SOIC-14, SOIC-16, SOIC-20, SOIC-24, and SOIC-28. The package uses gull-wing leads that extend from the sides and are soldered to the PCB. A pin-1 orientation mark or notch identifies the first pin.

SOICs are designed for surface-mount boards and are typically soldered using reflow processes. They provide good electrical performance for a wide range of devices, including operational amplifiers, analog-to-digital and digital-to-analog converters, voltage regulators, memory, and logic ICs. Thermal performance is suitable for many applications but may be limited for high-power devices compared with larger packages.

Standardization and naming: The SOIC form factor is standardized by JEDEC and is commonly labeled as SOIC with a number indicating pin count (for example, SOIC-16). The package is part of a family of small-outline packages that offer a balance of pin density, manufacturability, and board space.