SOIC24

SOIC-24, or Small Outline Integrated Circuit with 24 pins, is a surface-mount package used for a wide range of integrated circuits. It features a rectangular molded plastic body with 24 gull-wing leads, 12 on each side, aligned along a 1.27 mm (0.050 inch) pitch. The common body width for 24-pin SOICs is around 7.5 mm, with overall length increasing with pin count. Pin 1 is indicated by a marker such as a dimple or bevel, and pin numbers typically proceed counterclockwise around the package.

This package is used for many device types, including operational amplifiers, analog-to-digital and digital-to-analog converters, buffers, logic ICs, and microcontrollers where a moderate pin count and compact footprint are desired. Its dual-row gull-wing leads provide good solder joint strength for reflow soldering and allow straightforward PCB footprint designs.

In use, the SOIC-24 is chosen for its balance of size, pin count, and performance. Designers consider factors such as parasitics, thermal dissipation, and leadframe quality, especially for higher-speed or high-density applications. Orientation and pinout must be verified from the specific device datasheet, as pin assignments vary between ICs.

Variants of the SOIC family differ by lead count and body dimensions, but the 24-pin form is among the most common for mid-range ICs. The package remains widely supported by automated assembly processes and is compatible with standard surface-mount fabrication flow.