chipletalapú

Chipletalapú refers to a chiplet-based architecture, a method of constructing integrated circuits by integrating multiple smaller dies, called chiplets, into a single package to form a complete system or subsystem. The approach emphasizes heterogenous integration, combining chiplets produced on different process nodes and by different foundries.

In chipletalapú designs, chiplets are connected via high-speed interconnects, either on a silicon interposer in 2.5D configurations or directly on a package substrate in 3D/monolithic stacks. The packaging can provide memory, I/O, or specialized accelerators in proximity to compute chiplets, enabling customization and scalability.

The concept gained prominence in the 2010s, with industry demonstrations of multi-chip modules and major vendors adopting chiplet strategies for CPUs and GPUs. Standards efforts, notably the Unified Chiplet Interconnect Express (UCIe) launched in the early 2020s, aim to define interoperable interfaces and packaging requirements.

Advantages include improved fabrication yield by using smaller dies, reduced cost for integrating silicon nodes, faster time-to-market through modular reuse, and greater flexibility to tailor solutions. Challenges involve interconnect latency and bandwidth, thermal management, IP protection, supply-chain coordination, and the need for widely adopted standards.

See also: Chiplet, System in Package, 2.5D/3D integration, UCIe, Heterogeneous computing.