ThroughSiliconVia
ThroughSiliconVia, often written as Through-Silicon Via or TSV, is a vertical electrical connection that traverses a silicon wafer or die to enable three-dimensional integration of multiple devices. TSVs shorten interconnect paths, increase density, and support packaging approaches that stack logic, memory, and sensors in a compact form.
A TSV is typically a filled or hollow conductive channel through silicon. Common fillings are copper or
Fabrication methods include via-first, via-middle, and via-last workflows, corresponding to when the via is created during
In packaging, TSVs enable 3D-IC stacks and redistribution layers. They are used with 2.5D integration, interposers,
Applications include high-performance processors, graphics devices, and high-bandwidth memory stacks, where TSVs provide high bandwidth, reduced
Challenges include process complexity, yield, cost, thermal management, and reliability concerns such as stress from coefficient