TQFP

Thin Quad Flat Pack (TQFP) is a type of surface-mount IC package that features a square or nearly square plastic body with a grid of gull-wing leads along all four sides. The “thin” designation refers to its reduced profile compared with standard quad flat packs, allowing higher pin counts in a compact footprint. TQFP parts are widely used for microcontrollers, DSPs, memory devices, and other integrated circuits in consumer electronics and embedded systems.

Physically, TQFP packages have flat sides and metal leads that extend outward from the body and then down to land pads on the circuit board. Lead pitch is commonly 0.5 mm, 0.65 mm, 0.8 mm, or 1.0 mm, with body sizes typically ranging from about 7×7 mm to 20–24 mm and pin counts from around 32 up to the 100s or 200s, depending on pitch and package footprint. The package is designed for surface-mount assembly and is soldered to PCB pads using reflow soldering. In contrast to some other packages, TQFP generally does not include a central exposed thermal pad; heat is conducted mainly through the leads and the PCB.

Advantages of TQFP include a high pin density in a relatively small area, good mechanical rigidity, and broad availability. Disadvantages involve tighter manufacturing tolerances for fine pitches, greater potential for soldering defects such as bridging, and a more complex land-pattern design for PCB footprints.

TQFP is commonly compared with QFP and LQFP; it is distinguished by its thinner profile, enabling compact, high-pin-count solutions in modern electronics.