Pinnaliitettävät

Pinnaliitettävät, often translated as surface-mounted devices (SMDs), are electronic components designed to be soldered directly onto the surface of a printed circuit board (PCB). This manufacturing technique differs from the older through-hole technology, where component leads pass through holes drilled in the PCB and are soldered on the opposite side. The adoption of SMDs has revolutionized electronics manufacturing due to several advantages.

SMDs allow for smaller and more densely populated circuit boards, enabling the creation of more compact electronic devices. Their smaller size also contributes to lighter products. The automated assembly process for SMDs is significantly faster and more efficient than for through-hole components, leading to lower manufacturing costs and higher production volumes. Furthermore, SMDs generally exhibit better performance at higher frequencies due to their reduced parasitic inductance and capacitance.

The variety of SMDs is extensive, encompassing resistors, capacitors, inductors, diodes, transistors, and integrated circuits. These components come in various package types, each with specific dimensions and lead configurations, such as SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Pack), and BGA (Ball Grid Array). The selection of an appropriate SMD package depends on factors like component function, power dissipation, thermal management, and board space constraints. The widespread use of SMDs is a cornerstone of modern electronics, from smartphones and computers to automotive systems and medical devices.