Overflademonterede

Overflademonterede refers to electronic components and assemblies that are mounted directly on the surface of a printed circuit board (PCB) rather than through holes in the board. In English, the equivalent term is surface-mounted devices (SMD) and the related technology is surface-mount technology (SMT). Overflademonterede components are typically smaller, lighter, and designed with flat contact pads that facilitate automated placement and soldering.

Common examples include chip resistors and chip capacitors, as well as diodes, transistors, and integrated circuits in various surface-mount packages such as SOIC, QFP, BGA and CSP. Sizes are often described in both imperial and metric terms (for example 0402, 0603, 0805 or their metric equivalents), reflecting a wide range of component scales. The manufacturing process usually involves applying solder paste with a stencil, placing components with pick-and-place machines, and joining them by reflow soldering. Larger assemblies or mixed technologies may also use wave soldering for certain through-hole or high-power components.

Advantages of overflademonterede technology include high component density, reduced board area and weight, improved suitability for automated production, and favorable electrical performance due to shorter lead lengths at high frequencies. Disadvantages can include thermal management challenges for power-dense parts, greater difficulty in manual repair or rework, and reliance on precise process control for solder paste application and inspection.

Historically, SMT emerged in the late 20th century and gradually supplanted many through-hole approaches in consumer electronics and other mass-produced devices. Standards and practices, including RoHS-compliant solder and IPC footprint guidelines, support consistent design and manufacturing of overflademonterede assemblies.