MultiChip

Multichip refers to a packaging or integration approach in which two or more integrated circuits are combined within a single module or package. The goal is to increase system performance, reduce interconnect length, save board space, and enable heterogeneous integration by placing different dies—such as processors, memory, and analog components—close together.

Common forms include multi-chip modules (MCMs), where dies are mounted on a single substrate and connected by wire bonds or flip-chip interconnects, often with an interposer to route signals. System in Package (SiP) places multiple chips inside one package along with passive components to deliver a compact, functional unit. Chip-scale packaging is related and emphasizes a package size close to the size of the die, though multichip implementations may use larger footprints to accommodate several dies.

Advantages of multichip packaging include shorter interchip connections, higher potential bandwidth, reduced latency, and flexible integration of heterogeneous components. It can also lower system-level component count and enable faster time to market for complex functions. Challenges include thermal management, more complex testing and quality assurance, manufacturing yield considerations, and reliability concerns due to multiple dies and interfaces within a single module.

Applications span high-performance computing, telecommunications, graphics and multimedia accelerators, embedded systems, and aerospace where dense integration and specialized interconnects are valuable. Multichip approaches coexist with other packaging strategies such as system-on-chip (SoC) and advanced chip-scale solutions, each chosen to meet specific performance, power, and cost requirements.