MicroSOIC

microSOIC, or micro Small Outline Integrated Circuit, is a family of small-outline IC packages used for surface-mount devices. It is a smaller variant of the standard SOIC package, designed to reduce board area and profile while preserving a gull-wing lead form factor on two opposite sides of the rectangular body. MicroSOIC packages typically accommodate low to moderate pin counts, commonly 8 to 28 pins, enabling compact op-amps, regulators, and microcontrollers in portable and space-constrained applications. The body width and pitch vary by manufacturer and device family, so exact dimensions are specified in device data sheets; there is no single universal standard for microSOIC dimensions.

The package is intended for surface-mount assembly and is compatible with standard reflow soldering processes. Lead frames are connected to the silicon die via wire bonding or flip-chip techniques, depending on device. Thermal and electrical performance in microSOIC packages follows the same general rules as other SOIC-based packages of similar pin count, but the reduced body size can impose stricter thermal design for power-intensive devices.

There are several related small-outline packages, such as MSOP and TSSOP, with different footprints and lead counts. Designers choose microSOIC when space savings justify the package size, balancing pin count, heat dissipation, and PCB real estate. In practice, microSOIC dimensions, pad layouts, and tolerances are defined by the individual device manufacturer's datasheet, rather than a single governing standard.