Kuivapeilaus

Kuivapeilaus is a Finnish term that translates to "dry mirroring" or "dry reflection." It refers to a specific technique used in the context of metal plating, particularly in the creation of printed circuit boards (PCBs) and other electronic components. The primary purpose of kuivapeilaus is to ensure a uniform and complete coating of metal, often copper, on the surface of a substrate.

This process is employed to address challenges related to plating uneven or complex geometries, such as through-holes or intricate patterns. In traditional wet plating methods, achieving consistent thickness and adhesion in all areas can be difficult due to factors like current distribution and solution flow. Kuivapeilaus aims to overcome these limitations by preparing the surface in a way that promotes a more even deposition of the plating material.

The specifics of the kuivapeilaus technique can vary depending on the application and the materials involved. However, it generally involves pre-treating the substrate with a special chemical formulation. This formulation modifies the surface properties, making it more receptive to the subsequent plating process. The outcome is a more reliable and higher-quality metal layer, which is crucial for the functionality and longevity of electronic components. This method contributes to better electrical conductivity and improved mechanical integrity of the plated features.