Flerkomponents

Flerkomponents are modular hardware units designed to integrate sensing, processing, memory, and communication into a single compact module. They are used to simplify the design of embedded and autonomous systems by reducing interconnects and custom PCB layout. The concept emerged in the early 2010s in response to increasing complexity in robotic and IoT platforms and has since been adopted in both industrial prototyping workflows and commercial products.

Typical flerkomponent consists of three parts: a sensor or actuator interface block, a processing core (microcontroller or microprocessor or FPGA), and a power/communication management layer. Some variants include onboard memory and programmable logic, enabling standalone operation or tight integration with host systems. Interfacing follows standard protocols such as I2C, SPI, UART, CAN, Ethernet, and USB.

Form factors vary, commonly around 20x20 mm to 40x40 mm modules, with standardized pinouts to facilitate plug-and-play stacking or docking. Software stacks usually provide firmware that abstracts hardware specifics and offers APIs for sensor data, control loops, and communication.

Advantages include faster prototyping, lower wiring density, and easier upgrades. Use cases span robotics, automotive, industrial automation, and consumer electronics. Challenges include thermal management, cost and interoperability across generations, and obsolescence risk, with finite lifecycle expectations requiring careful supply-chain planning.

See also System on Module, modular robotics, embedded system, plug-in module.