Elektroniklödningslöd

Elektroniklödningslöd, often shortened to löd, is a consumable material used in electronics assembly to create permanent electrical connections between components and printed circuit boards. It is a fusible metal alloy that melts at a relatively low temperature, allowing it to flow into the gaps between the mating surfaces and solidify upon cooling. This solidified alloy forms a strong, conductive bond.

The primary components of traditional löd are tin and lead, with common alloys being 60% tin and 40% lead (Sn60Pb40) or 63% tin and 37% lead (Sn63Pb37), the latter being eutectic and melting at a single, precise temperature. Due to environmental and health concerns, lead-free löd has become increasingly prevalent. These lead-free alloys typically consist of tin combined with other metals such as silver, copper, bismuth, or indium. The melting points of lead-free löd are generally higher than their leaded counterparts.

Löd is typically supplied in wire form, often with a flux core. The flux is a chemical cleaning agent that removes oxides and other contaminants from the surfaces to be joined, promoting better wetting and a more reliable solder joint. During the soldering process, heat is applied to the joint using a soldering iron or other heating equipment, causing the löd to melt. Once melted, the löd is drawn into the gap by capillary action and then cools to form the electrical and mechanical connection. Proper soldering technique is crucial for creating strong, void-free joints that can withstand mechanical stress and electrical current.