Home

Sn63Pb37

**Sn63Pb37**

Sn63Pb37 is a common alloy composed primarily of tin (Sn) and lead (Pb), with a specific composition of 63% tin and 37% lead by weight. This eutectic alloy is well-known for its low melting point, making it useful in applications requiring thermal conductivity and soldering properties. The eutectic nature of this alloy—meaning it melts at a single, fixed temperature—occurs at approximately 183°C (361°F), which is lower than many other lead-based solders, contributing to its widespread use in electronics and other industries.

One of the primary advantages of Sn63Pb37 is its reliability in soldering processes. It provides strong adhesion

However, due to environmental and health concerns regarding lead, the use of Sn63Pb37 has been gradually phased

The alloy’s mechanical properties, including its ductility and resistance to corrosion, also make it suitable for

to
various
metals,
including
copper,
brass,
and
steel,
while
maintaining
good
thermal
and
electrical
conductivity.
This
alloy
has
been
widely
used
in
the
electronics
industry,
particularly
in
the
assembly
of
printed
circuit
boards
(PCBs),
due
to
its
ease
of
use
and
cost-effectiveness
compared
to
other
soldering
materials.
out
in
many
regions
in
favor
of
lead-free
alternatives,
such
as
SnAgCu
alloys.
Despite
this
shift,
Sn63Pb37
remains
relevant
in
legacy
applications
where
compatibility
with
existing
infrastructure
is
necessary.
applications
in
machinery,
bearings,
and
other
industrial
components
where
durability
is
important.
While
lead-based
solders
are
being
replaced,
Sn63Pb37
continues
to
be
studied
for
its
unique
characteristics
in
specialized
applications.