Chipmodels

Chipmodels refers to the collection of models that describe the electrical, thermal, and physical behavior of integrated circuits at different levels of abstraction. They include device-level transistor and diode models, circuit-level netlists, timing and power models, and representations of parasitics and thermal effects.

Purpose and scope: These models enable design, verification, and validation across a chip’s lifecycle. They let engineers predict delay, leakage, noise, and drive strength; estimate system performance, power, and area; and assess reliability under varying temperatures and aging. They are essential for sign-off simulations that test worst-case conditions.

Components and formats: Common families include transistor models such as BSIM and EKV variants, SPICE-compatible device models, and behavioral models described in Verilog-A. Interconnect and package parasitics, as well as thermal models, may be included. Data are stored as SPICE netlists, Liberty timing libraries, and vendor-specific repositories, with interoperability aided by standard interfaces.

Development and access: Chipmodels are produced by foundries, IC vendors, EDA tool makers, and research groups. They can be proprietary or open-source, with licensing varying by provider. Open formats and reference models support collaboration and method development.

Limitations and best practices: Models are approximations calibrated to process, voltage, and temperature. Designers perform validation, corner-case testing, and sensitivity analyses, and maintain multiple model versions to reflect technology updates.