COBmodules

COBmodules refer to modular units that use Chip-on-Board (COB) technology. In a COB module, multiple bare semiconductor dies are mounted directly on a common substrate and electrically connected, then encapsulated to form a single, compact light-emitting or sensing component. The approach yields a high density of emission points and uniform color and intensity, while reducing interconnect complexity compared with conventional packaged LEDs.

COB modules typically use a metal-core or aluminum-backed substrate to provide heat spreading. Die attach methods may include sintered metal, conductive epoxy, or soldering. Dies are connected by wire bonds or flip-chip routes, then covered with phosphor-converted resin or silicone encapsulant to form a uniform light-emitting surface. Electrical input is provided through a few contacts on the substrate, allowing a single-driver interface.

Because many diodes are integrated on one block, COB modules offer high luminous density, improved thermal management, and smooth, shadow-free light. They often exhibit higher optical efficiency per package and lower packaging costs per lumen. They require constant-current drivers and careful thermal design to maintain color consistency and lifetime.

Applications include architectural lighting, downlights, signage, automotive headlights, stage lighting, horticultural lighting, and backlighting for displays.

Manufacturers and users should consider binning for color and brightness, thermal margins, serviceability, and compliance with safety and electromagnetic compatibility standards.