lisäjuottaminen

Lisäjuottaminen, often translated as "additional soldering" or "re-soldering," is a technique used in electronics assembly and repair to strengthen or repair existing solder joints. It involves applying additional solder to a joint that has already been soldered, either to improve its mechanical strength, enhance its electrical conductivity, or to fix a defect such as a cold solder joint or a crack.

This process is typically performed when a component needs to be securely attached, or if a joint is suspected of being weak or unreliable. For example, in applications where components are subjected to vibration or mechanical stress, lisäjuottaminen can help prevent failure. It is also a common troubleshooting step when diagnosing intermittent electrical problems.

The technique requires careful application of heat and solder to avoid damaging the surrounding components or the printed circuit board. The existing solder joint is heated to its melting point, and then additional solder is flowed into the joint. This new solder mixes with the old, creating a more robust connection. Proper cleaning of the joint before applying additional solder is crucial for a good outcome, as flux residues or oxidation can prevent the new solder from adhering properly. While effective, overuse of lisäjuottaminen can lead to excessive heat exposure, potentially damaging sensitive components or the PCB. Therefore, it is generally applied judiciously where specifically needed.