jäähdytysliimat
Jäähdytysliimat, also known as thermal adhesive or thermally conductive glue, are specialized adhesives designed to conduct heat away from electronic components. They are crucial in applications where heat dissipation is essential for the reliable operation and longevity of devices. These materials combine the bonding properties of adhesives with the thermal conductivity of fillers.
The primary function of jäähdytysliimat is to bridge microscopic air gaps between a heat-generating component, such
Jäähdytysliimat typically consist of a polymer matrix, often epoxy or silicone-based, filled with thermally conductive particles
Common applications include attaching heat sinks to processors, power transistors, LEDs, and other heat-producing electronic parts.