Jäähdytysliimat

Jäähdytysliimat, also known as thermal adhesive or thermally conductive glue, are specialized adhesives designed to conduct heat away from electronic components. They are crucial in applications where heat dissipation is essential for the reliable operation and longevity of devices. These materials combine the bonding properties of adhesives with the thermal conductivity of fillers.

The primary function of jäähdytysliimat is to bridge microscopic air gaps between a heat-generating component, such as a CPU or GPU, and a heat sink. Air is a poor conductor of heat, so these gaps create thermal resistance. Jäähdytysliimat fill these voids, creating a more efficient thermal path for heat to transfer to the heat sink, which then dissipates it into the surrounding environment.

Jäähdytysliimat typically consist of a polymer matrix, often epoxy or silicone-based, filled with thermally conductive particles like ceramics (e.g., aluminum oxide, boron nitride) or metals (e.g., aluminum, silver). The type and amount of filler influence the thermal conductivity of the adhesive. They are applied as a liquid or paste and cure to form a solid bond.

Common applications include attaching heat sinks to processors, power transistors, LEDs, and other heat-producing electronic parts. They offer an alternative to mechanical fasteners and thermal paste, providing both thermal management and structural adhesion. The selection of a specific jäähdytysliima depends on factors such as required thermal conductivity, curing time, operating temperature range, electrical conductivity, and mechanical strength.