TEMSEM

TEMSEM is an acronym used in materials science and electrical engineering to denote a consolidated approach for simulating and analyzing the interactions between thermal and electromagnetic phenomena in materials and devices. The concept centers on coupled multi-physics modeling, where heat transfer, electromagnetic fields, and related mechanical or structural responses influence one another. TEMSEM aims to provide integrated insights into how temperature rises, electrical currents, and material properties interact under real-world operating conditions.

A typical TEMSEM framework combines a solver core for coupled thermo-electromagnetic problems, a material property database, and geometry/mesh generation with flexible boundary and initial conditions. It supports time-domain and frequency-domain analyses, enabling researchers to study transient heating, steady-state heating, electromagnetic interference, and emission characteristics. Post-processing tools within TEMSEM facilitate visualization of temperature distributions, current densities, EM field patterns, and derived metrics such as thermal resistance and EMC compliance indicators. scripting interfaces and interoperability with other simulation tools are common to allow workflow automation and parametric studies.

Applications of TEMSEM span microelectronics cooling, power electronics, RF and microwave devices, photonics, metamaterials, and MEMS. By enabling simultaneous consideration of thermal and electromagnetic effects, TEMSEM supports design optimization, reliability assessment, and failure analysis. Adoption varies by region and sector, with both commercial software packages and research-focused toolkits incorporating TEMSEM-like capabilities. Limitations include high computational cost and dependence on accurate material models, which require careful validation against experimental data. See also: finite element method, computational electromagnetics, multiphysics simulation, thermal analysis.