SO8

SO-8, short for small-outline 8-pin, is a widely used surface-mount integrated circuit package designed to hold eight electrical connections. It features a rectangular plastic body with gull-wing leads on both long sides, four leads per side. The package is intended for automated surface-mount assembly and is compatible with reflow soldering.

Physical characteristics commonly associated with SO-8 include a body width of roughly 3.9 to 4.4 mm and a body length around 6.0 to 6.5 mm, with a lead pitch of about 1.27 mm. The overall package height is typically in the 1.0 to 2.0 mm range. The leads extend from the sides and bend downward to form the electrical contacts on the printed circuit board. Pin 1 is indicated by a notch or dot on the package, and pins are numbered counterclockwise when viewed from the top. While the general form and pin count are standardized, the exact pinout depends on the specific device, so the manufacturer’s datasheet should be consulted for correct connections.

Common applications of SO-8 packages include op-amps, voltage regulators, comparators, and analog switches, as well as other small mixed-signal ICs. The format offers a compact footprint and good suitability for automated production, but its thermal performance is limited for high-power devices, and thermal management should be considered in the design.

Alternatives in the same family include SOP-8/SOIC-8 variants with similar pin counts but different body dimensions or lead configurations. Designers should verify pinout compatibility across manufacturers and consider package size relative to thermal and electrical requirements.