Kiselplattor

Kiselplattor, also known as silicon wafers, are thin discs made from pure silicon. They serve as the fundamental substrate for the fabrication of integrated circuits, commonly known as microchips or computer chips. The production of kiselplattor is a highly specialized and complex process, beginning with the purification of silicon to an extremely high degree, often referred to as semiconductor-grade silicon. This purified silicon is then melted and solidified into large cylindrical ingots through a process called crystal growth, typically the Czochralski method.

These ingots are then sliced into thin wafers, which are polished to achieve an exceptionally smooth and defect-free surface. The diameter of these wafers can vary, with common sizes including 100mm, 150mm, 200mm, and 300mm. The precise dimensions and uniformity of the kiselplatta are critical for the subsequent photolithography and etching processes used to create intricate patterns of transistors and other electronic components on their surface.

Once manufactured, kiselplattor undergo a series of fabrication steps in a cleanroom environment. These steps involve depositing various materials, etching away sections, and doping the silicon to create the desired electrical properties. After the fabrication is complete, the wafer contains hundreds or thousands of individual integrated circuits, which are then tested, cut into individual chips, and packaged for use in electronic devices. Kiselplattor are the cornerstone of the modern semiconductor industry, enabling the creation of everything from smartphones and computers to advanced medical equipment and automotive electronics.