nonTO220

nonTO220 refers to electronic components that are not housed in the TO-220 package. The TO-220 is a common, plastic insulated package for medium-power transistors and integrated circuits. It features three leads and a metal tab with a hole for heatsink mounting. Many electronic components, however, are designed with different packaging to meet specific requirements such as size, thermal management, electrical isolation, or cost.

Components that are nonTO220 come in a vast array of package types. These include, but are not limited to, surface-mount devices (SMD) like SOT-23, SOIC, and QFN, which are soldered directly onto a printed circuit board. Through-hole components not in TO-220 packages might be in smaller plastic packages like TO-92 or metal cans. High-power applications often utilize larger packages like TO-247, TO-3, or specialized modules that offer superior thermal dissipation and electrical isolation capabilities. The choice of a nonTO220 package depends on the specific application's needs for power dissipation, voltage, current, board space, and manufacturing process.