jäähdytinlevyjen

Jäähdytinlevy, known in English as a heatsink, is a passive heat exchanger that cools a device by dissipating heat into the surrounding medium. Typically, this medium is air, but it can also be water or other fluids. Heatsinks are commonly used in electronic devices to remove heat generated by components such as CPUs, GPUs, and power transistors. The principle behind their operation is heat transfer: heat flows from the hotter component to the heatsink, which then disperses it over a larger surface area.

Heatsinks are often made from materials with high thermal conductivity, such as aluminum or copper. Aluminum is a popular choice due to its light weight and relatively low cost, while copper offers superior thermal conductivity but is heavier and more expensive. The design of a heatsink is crucial for its effectiveness. It typically features a base that makes contact with the heat-generating component and a series of fins or pins that extend into the cooling medium. These fins significantly increase the surface area available for heat dissipation.

The efficiency of a heatsink can be influenced by factors like the material used, the shape and size of the fins, and the airflow around it. In applications where natural convection is insufficient, active cooling methods, such as the addition of a fan, are employed to force air over the heatsink, thereby enhancing heat removal. The proper functioning of many electronic devices relies on effective heat management provided by heatsinks to prevent overheating and ensure longevity.