Tyhjiöpinnoitus
Tyhjiöpinnoitus, also known as vacuum metallization, is a process used to deposit a thin layer of metal onto a substrate. This technique is commonly employed in the manufacturing of electronic components, such as semiconductors and integrated circuits, as well as in the production of optical coatings and decorative films. The process involves creating a vacuum environment to ensure that the metal atoms or ions can travel unimpeded from the source to the substrate. This vacuum environment is typically achieved using vacuum pumps that remove air and other gases from the chamber.
The vacuum metallization process can be further categorized into two main types: physical vapor deposition (PVD)
The advantages of vacuum metallization include the ability to deposit uniform and adherent metal films with
In summary, Tyhjiöpinnoitus, or vacuum metallization, is a versatile and widely used technique for depositing thin