Sn30Ag05Cu
Sn30Ag05Cu (commonly written Sn-3.0Ag-0.5Cu and marketed as SAC305) is a lead-free tin–silver–copper solder alloy widely used in electronic assembly. Its nominal composition is about 96.5% tin, 3.0% silver and 0.5% copper by mass. The alloy was developed as a RoHS-compliant replacement for traditional tin–lead solders.
The alloy has a melting range rather than a single eutectic point, with liquidus temperatures typically around
SAC305 is commonly used in surface-mount and mixed-technology assemblies in consumer, automotive and industrial electronics. Typical
Standards and industry guidelines for lead-free soldering, such as IPC specifications and RoHS directives, include SAC305