Koolstoffilmsystemen

Koolstoffilmsystemen are liquid cooling systems that use thin, flexible polyethylene-based films to transfer heat from electronic components to a coolant reservoir. The film acts as a heat spreader, increasing the surface area in contact with the component while maintaining a low thermal resistance. The coolant, typically water or a water‑ethylene glycol mixture, is pumped through the film’s embedded channels and turns back by convection or external heat sinks.

The concept originated in the early 2010s as a response to the rising power densities of CPUs, GPUs and power electronics. By embedding the film around a heat sink or directly over a die, manufacturers can reduce temperatures without the need for bulky fans or complex thermal interface materials. Typical applications include high‑end gaming PCs, server racks, automotive power units and industrial control panels. Compared with solid thermal pads, films offer improved fill‑factor and can conform to uneven surfaces, but they require a reliable fluid loop and regular maintenance to prevent leakage.

Key technical parameters are film thickness (often between 50 and 200 µm), thermal conductivity (up to 0.5 W·m⁻¹·K⁻¹), and channel geometry. Most commercial suppliers integrate the film with heat spreaders and provide a pre‑filled coolant cartridge. The main disadvantages are the added complexity of a closed‑loop system and the potential for coolant contamination, which can degrade performance over time. Despite these challenges, Koolstoffilmsystemen are increasingly adopted in environments where space constraints and high heat fluxes demand efficient passive cooling solutions.