Interconnectmaterial

Interconnectmaterial refers to the materials used in the fabrication of interconnects, which are the conductive pathways that connect various components within an integrated circuit (IC) or other electronic devices. These materials play a crucial role in determining the performance, reliability, and cost of electronic devices. Common interconnect materials include copper, aluminum, and more recently, materials like tungsten and cobalt.

Copper is widely used due to its excellent conductivity and relatively low resistivity. However, it is susceptible to electromigration, a phenomenon where atoms are transported due to the momentum transfer between conducting electrons and diffusing metal atoms. This can lead to void formation and eventual failure of the interconnects.

Aluminum was one of the first materials used for interconnects but has largely been replaced by copper due to its higher resistivity and susceptibility to hillock formation, which can cause short circuits.

Tungsten is often used as a via fill material due to its high melting point and good adhesion to silicon dioxide. Cobalt is another material gaining attention for its potential to replace copper in advanced interconnects due to its lower resistivity and resistance to electromigration.

The choice of interconnect material is influenced by factors such as the required conductivity, resistance to electromigration, compatibility with the fabrication process, and cost. As technology advances, the demand for materials with better performance and reliability continues to grow, driving research and development in the field of interconnect materials.