Imaging methods used in technologiesimaging span non-destructive and destructive approaches. Non-destructive options include optical microscopy, infrared thermography, and X-ray imaging (radiography and computed tomography); scanning tunneling, scanning electron, and transmission electron microscopy; optical coherence tomography; and hyperspectral or multispectral imaging. Destructive methods may involve sectioning or focused ion beam milling followed by high-resolution imaging. Computational imaging and 3D reconstruction techniques convert raw data into quantitative models of geometry, composition, and stress fields.
Applications cover semiconductor inspection and failure analysis, materials development, additive manufacturing inspection, and quality control of manufactured components. In energy, imaging informs battery and photovoltaic material studies. In data storage, imaging supports characterization of thin films and interfaces. Beyond engineering, technologiesimaging is used in forensic investigations of devices, historical technology artifacts, and educational visualization.
Typical workflows start with problem definition and selection of imaging modalities, followed by data acquisition, alignment, noise reduction, and feature extraction using computer vision and machine learning. Quantitative outputs may include porosity measurements, layer thickness, crack propagation, or mode shapes. Results support design decisions, process optimization, and documentation for standards compliance.
Challenges include balancing resolution, speed, and cost; handling large data volumes; ensuring non-destructive methods do not alter specimens; and standardizing protocols across laboratories. Ongoing developments in adaptive optics, higher-field detectors, and perceptually driven image analysis are expanding the reach of technologiesimaging into new materials and devices.