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Reflow soldering is a process used in the electronics industry to attach components to printed circuit boards. It is a key technique for surface-mount technology (SMT) assembly, where electronic components with leads or pads are placed onto solder paste that has been applied to the board. The board and components are then heated in a controlled manner, typically in a reflow oven, causing the solder paste to melt, flow, and solidify, creating electrical and mechanical connections.
The reflow soldering process involves several stages. First, solder paste, a mixture of solder powder and flux,
Proper temperature profiling is critical for successful reflow soldering. This profile ensures that all components are