microinterconnects
Microinterconnects are the conductive networks that connect active devices and components within microelectronic devices, most notably integrated circuits. They consist of metal lines and vias embedded in dielectric layers, forming a multilayer interconnect stack that routes signals and power between transistors, capacitors, and I/O pads. As device features shrink, interconnects become a dominant source of resistance, capacitance, and delay, influencing overall circuit performance.
Materials and fabrication: Copper has become the standard interconnect metal in modern CMOS processes, replacing aluminum
Reliability and design: Key concerns include RC delay, electromigration, stress-induced voiding, and crosstalk. Thermal management and
Extensions: In 3D integration and heterogeneous packaging, microinterconnects extend across multiple dies or into interposer substrates,