lämpötiivistettä

Lämpötiivistettä, often translated as thermal paste or thermal compound, is a substance used to improve heat transfer between two surfaces, typically a heat-generating component like a CPU or GPU and a heat sink. Its primary function is to fill microscopic air gaps that exist between these surfaces, as air is a poor conductor of heat. By displacing the air, lämpötiivistettä creates a more efficient thermal path, allowing heat to be drawn away from the component more effectively.

The composition of lämpötiivistettä varies, but it generally consists of a base material, such as silicone or synthetic oil, mixed with thermally conductive fillers. Common fillers include metal oxides (like aluminum oxide or zinc oxide), ceramic particles, or even silver or diamond dust for higher performance applications. These fillers are responsible for the material's ability to conduct heat.

Proper application of lämpötiivistettä is crucial for optimal performance. A thin, even layer is usually recommended. Too much lämpötiivistettä can act as an insulator, while too little may not adequately fill the air gaps. Over time, lämpötiivistettä can dry out or degrade, leading to a reduction in thermal conductivity. In such cases, it may need to be reapplied to maintain efficient cooling. Its use is a standard practice in the assembly of computers and other electronic devices where heat management is critical.