lämpötahnat

Lämpötahnat, often referred to as thermal paste or thermal compound, are essential materials used in the assembly of electronic devices, particularly those that generate significant heat. Their primary function is to improve thermal conductivity between a heat-generating component, such as a CPU or GPU, and its heatsink. Without thermal paste, air pockets would form between the two surfaces, significantly hindering heat transfer and potentially leading to overheating and component damage.

The effectiveness of thermal paste relies on its ability to fill microscopic imperfections on the surfaces of the component and the heatsink. These imperfections, invisible to the naked eye, would otherwise trap air, which is a poor conductor of heat. By displacing this air, thermal paste creates a more contiguous path for heat to dissipate.

Thermal pastes are typically composed of a base fluid and thermally conductive fillers. Common base fluids include silicone oils or synthetic hydrocarbons. Fillers can vary widely and often include metal oxides (like aluminum oxide or zinc oxide), ceramics, or even metallic particles (like silver or copper). The type and amount of filler determine the thermal conductivity of the paste, with higher conductivity pastes generally offering better cooling performance.

Application of thermal paste is straightforward. A small amount is applied to the center of the heat-generating component's surface. When the heatsink is mounted, the pressure evenly spreads the paste, forming a thin, uniform layer. Reapplication may be necessary over time as thermal paste can dry out or degrade, reducing its effectiveness.