copperclad

Copperclad refers to materials that have a layer of copper bonded to a substrate to provide electrical conductivity while leveraging the substrate’s mechanical and insulating properties. This combination is widely used in the electronics industry, most notably as copper-clad laminates for printed circuit boards, but also in other forms such as copper-clad metals for shielding and connectors.

Common forms include copper-clad laminates, where copper foil is bonded to non-conductive cores such as FR-4 (epoxy glass), FR-2 (phenolic paper), or polyimide. Copper-clad metals, such as copper-clad aluminum or copper-clad steel, pair copper with a metal core to achieve a balance of conductivity, weight, and strength. The copper layer is typically a few tens of micrometers thick and is usually specified in ounces per square foot (for example, 1 oz equals about 35 micrometers of copper).

Manufacturing involves bonding copper foil to the substrate through lamination, adhesion promoters, and heat and pressure, followed by processes such as drilling, plating, and etching in PCB fabrication. The resulting material is used as the starting point for patterned electrical circuits, where copper is selectively removed to form traces. Copperclad laminates are also used in EMI shielding and heat dissipation applications.

Key properties include high electrical and thermal conductivity of copper, good solderability, and relatively low cost, balanced against substrate compatibility and adhesion performance. Limitations can involve adhesion robustness under thermal cycling, moisture sensitivity in certain substrates, and variations in copper thickness. Standards and specifications for copper-clad materials govern thickness, plating quality, and laminate integrity to ensure suitability for electronic manufacturing.