Solderpaste
Solder paste is a semi-solid mixture of metal solder powder and flux used to join electronic components to printed circuit boards (PCBs) in surface-mount technology (SMT) assembly. It is typically deposited onto PCB pads through a stencil or dispensed by jet printing, components are placed on the paste, and the assembly is heated in a reflow oven to melt the solder and form metallurgical joints.
Composition varies with alloy and flux chemistry. Common alloys include traditional tin–lead (e.g., Sn63Pb37) and lead-free
Process control and storage are important for quality. Stencil design, print parameters, and paste rheology affect
Safety considerations include using proper ventilation to control fumes, personal protective equipment, and adherence to waste