RDNA3

RDNA3 is the third generation of AMD's Graphics Core Next (GCN) architecture for graphics processing units (GPUs). It was first unveiled in December 2022 with the launch of the Radeon RX 7000 series of graphics cards. RDNA3 represents a significant architectural shift, incorporating several key advancements aimed at improving performance, power efficiency, and feature set.

A defining characteristic of RDNA3 is its chiplet-based design, a first for mainstream consumer GPUs. Instead of a monolithic GPU die, RDNA3 utilizes a combination of a Graphics Compute Die (GCD) manufactured on a 5nm process and Memory Cache Dies (MCDs) manufactured on a 6nm process. This modular approach allows for better cost optimization and scalability.

RDNA3 introduces new compute units (CUs) that are redesigned for higher clock speeds and increased instruction per clock (IPC). These CUs feature improved ray tracing acceleration hardware and support for new AI-accelerated features. The architecture also boasts an increased number of CUs and a larger L3 cache, contributing to enhanced gaming performance and overall throughput.

Power efficiency is a notable focus for RDNA3, with advancements in power management and the use of more advanced manufacturing processes. This aims to deliver more performance per watt compared to previous generations. RDNA3 also brings support for the latest display standards, including DisplayPort 2.1, enabling higher resolutions and refresh rates.