Overflademontage

Overflademontage, often abbreviated as SMT (Surface Mount Technology), is a method in which the electric components are mounted directly onto the surface of a printed circuit board (PCB). This technique has largely replaced the older through-hole technology, where component leads were inserted into holes drilled through the board. SMT components are typically smaller and have no leads or short leads that can be soldered directly to the PCB surface.

The process of overflademontage involves several key steps. First, solder paste is applied to the pads on the PCB where the components will be placed, usually by a stencil. Then, automated pick-and-place machines accurately position the components onto the solder paste. The board then passes through a reflow oven, where the solder paste melts and solidifies, creating electrical and mechanical connections between the components and the PCB. For components that cannot be reflow soldered, such as some larger components or those requiring different thermal profiles, wave soldering might still be used after the initial SMT process.

Overflademontage offers several advantages over through-hole technology. It allows for smaller and more densely populated PCBs, which is crucial for modern electronic devices that are becoming increasingly compact. SMT components are also generally cheaper to manufacture and handle, leading to lower production costs. Furthermore, the automated nature of SMT allows for higher production speeds and greater consistency. This makes it the dominant technology in the manufacturing of consumer electronics, telecommunications equipment, and a wide range of other electronic products.