Lävipäästöelektroniikka

Lävipäästöelektroniikka, often translated as "through-hole electronics" in English, refers to a type of electronic component mounting technology where component leads are inserted into holes drilled through a printed circuit board (PCB) and soldered to pads on the opposite side. This method is in contrast to surface-mount technology (SMT), where components are attached directly to the surface of the PCB without needing holes.

In lävipäästöelektroniikka, components have pins or leads that extend from their body. These leads are then pushed through pre-drilled holes in the PCB. Once positioned, the leads are soldered to conductive pads on the underside of the board, creating an electrical connection. This soldering process can be done manually, wave soldering, or reflow soldering with specific considerations for through-hole components.

This technology offers several advantages. Through-hole components are generally considered more robust and can withstand greater physical stress and vibration compared to SMT components. This makes them suitable for applications where durability is paramount, such as in industrial equipment, automotive electronics, and some consumer electronics. The larger solder joints also provide better mechanical strength.

However, lävipäästöelektroniikka has some drawbacks. It requires drilling holes in the PCB, which adds to manufacturing cost and complexity. It also takes up more space on both sides of the board compared to SMT, limiting the density of components that can be placed. Furthermore, automated assembly is generally slower and less efficient with through-hole components than with SMT. Despite the rise of SMT, lävipäästöelektroniikka remains a vital technology in certain electronic designs.